High-reliability coatings for electronic components and assemblies.
From connectors to circuit boards, Superior Surface Engineering provides coatings that ensure electrical performance, corrosion protection, and long-term reliability for both consumer and industrial electronics applications. Our processes are designed for the demanding requirements of modern electronic manufacturing.
Uniform deposition on complex geometries including PCB vias, connector pins, and RF shielding enclosures. Controlled phosphorus content for specific conductivity or corrosion resistance requirements.
Selective gold, silver, and palladium plating for connectors, contact pads, and wire bond surfaces. Ensures low contact resistance and reliable interconnections over millions of mating cycles.
RoHS-compliant tin and tin-alloy coatings that maintain excellent solderability through multiple reflow cycles. Whisker-mitigation strategies included for high-reliability applications.
Conductive coatings for electromagnetic shielding on plastic housings, enclosures, and board-level shields. Provides 40-80dB attenuation across 100MHz to 10GHz frequency range.
Multi-layer coating systems that protect sensitive electronics from moisture, salt spray, and industrial pollutants. Ideal for outdoor, marine, and harsh-environment electronic assemblies.
Precision masking and selective deposition for components requiring different coatings on specific areas. Minimizes precious metal usage while meeting performance specifications exactly where needed.
High-speed data connectors, power connectors, IC sockets, and spring-loaded contacts for consumer and telecom equipment.
Through-hole and via plating, ENIG (Electroless Nickel Immersion Gold) finishes, and copper protection for multi-layer circuit boards.
Lead frame plating, heat sink coatings, and bump metallization for advanced IC packages including BGA, QFN, and flip-chip configurations.
Heavy copper plating for bus bars, thermal interface coatings for IGBT modules, and corrosion protection for EV charging infrastructure components.
Ultra-thin, precise metallic layers for pressure sensors, accelerometers, and micro-electromechanical systems requiring sub-micron accuracy.
Reflective coatings, thermal management surfaces, and wire-bondable finishes for high-power LED packages and optical communication modules.
Whether you need high-volume connector plating or specialized coatings for advanced semiconductor packages, our engineering team can develop the optimal solution for your electronic components.