Where micron-level variations impact performance, our surface treatment solutions meet the stringent requirements of industries demanding microscopic precision and absolute consistency.
Our precision surface treatment processes are engineered to deliver controlled, repeatable results at the tightest tolerances demanded by advanced manufacturing.
Achieving surface roughness values (Ra) below 0.05 µm through controlled deposition parameters and advanced polishing techniques for optical and magnetic media applications.
Precise control of phosphorus content (low, medium, high) to achieve specific magnetic properties — from non-magnetic coatings for data storage to controlled permeability for sensor applications.
Coating thickness variation held within ±1 micron across the entire substrate surface, critical for components where dimensional accuracy determines system performance.
Engineered multi-layer coating stacks combining different compositions to achieve composite properties — such as an adhesion layer, functional layer, and protective top layer — each precisely controlled.
No edge build-up or thinning at corners — electroless deposition ensures perfectly uniform coverage on complex 3D geometries including internal features and recesses.
SPC-controlled processes with real-time bath monitoring ensure identical coating properties across production runs, meeting Cpk > 1.67 for critical parameters.
Our process controls and measurement systems enable us to achieve and verify tolerances that meet the most demanding specifications.
| Parameter | Standard | Precision Grade | Ultra-Precision |
|---|---|---|---|
| Thickness Tolerance | ±5 µm | ±2 µm | ±1 µm |
| Surface Roughness (Ra) | < 0.2 µm | < 0.1 µm | < 0.05 µm |
| Phosphorus Content | ±1.5% | ±0.5% | ±0.3% |
| Hardness (after HT) | ±50 HV | ±25 HV | ±15 HV |
| Coercivity (Hc) | ±5 Oe | ±2 Oe | ±1 Oe |
Our core expertise: disk substrates, actuator arms, spindle motors, and base plates for the hard disk drive industry — where nanometer-scale surface perfection directly determines recording density and drive reliability.
Process chamber components, wafer handling equipment, and test fixtures for semiconductor fabrication — where particle contamination must be zero and chemical resistance is paramount.
Mirror substrates, lens mounts, and precision optical assemblies requiring angstrom-level surface perfection and dimensional stability over temperature cycles.
Gyroscope components, guidance systems, and inertial navigation instruments where micro-variations in coating properties can affect mission-critical accuracy.
Bring us your most demanding specifications. Our team of precision surface engineers will develop a process solution that meets your exact requirements — verified by our in-house metrology lab.